24/11/2025
Xilinx: High-end FPGA supply remains tight
Xilinx’s FPGA components in the market are still in extremely short supply, with lead times for most automotive-grade products ranging from 40-52 weeks. Some mid-range products have even been discontinued. The shortage of high-end FPGAs in industrial control, communications infrastructure platforms, and other fields is particularly severe, and the current supply-demand imbalance is expected to continue until at least Q2 next year.
NXP: Automotive-grade MCUs face strong competitive pressure from Germany
In November, NXP once again raised prices and extended lead times. With vehicle inventory consumption nearing completion, new car orders are gradually resuming, and stockpiling in the market is starting in the fourth quarter. Inventory levels are returning to normal. NXP has been actively expanding production since Q1 2026 (Note: likely a typo in the original, should be 2026). The capacity ramp-up period for automotive MCUs is long, and NXP still maintains a strong competitive edge. Its smart cockpits, gateways, and other core components remain in short supply, and the overall market situation is relatively tight.
Broadcom: Exchange chips and PCIe retimers are in severe shortage
Recently, the hottest chips in the AI server segment have been Broadcom’s BCM5699 series high-speed exchange chips. This product is in extremely short supply, with delivery times in the spot market exceeding one year in some cases, and prices have also risen significantly across the board. In AI-related products, SS24 price increases are continuous, but SS26 has begun to stabilize, with prices even showing a slight downward trend in some cases.
TI: Logic and power product shipments are significantly increasing
TI has announced a substantial increase in shipments of logic products. Inquiries for the SN74 series logic chips have clearly risen. In addition, TI has officially started mass production of the new-generation automotive-grade Tps and TIV series power management chips. In the first November batch, TI shipped nearly 600,000 units to the Asia-Pacific region alone, with another 1.4 million units scheduled for delivery. This is TI’s strongest single-month shipment in 2023, marking the first time the company has “opened the floodgates” to release over 90% of its long-delayed backlog.
Renesas: Key areas continue to see supply shortages
Overall market demand remains strong, but shortages persist in automotive and industrial applications. Lead times for many automotive-grade products are still 20-45 weeks. MCU products continue to be in short supply, especially the RSF2 and RSF5 series used in engine control, body electronics, and electric powertrain scenarios. These products may face even tighter supply in the short term, and it is recommended to place orders as early as possible.
STMicroelectronics: Full range of 18nm high-performance MCUs launched
ST has introduced the 18nm microcontroller STM32V8, with SpaceX already selecting it for the Starlink satellite constellation. This is the first time ST has achieved a technological breakthrough in the advanced process node space. ST indicates that the product adopts a 4MB non-volatile PCM solution and has the smallest unit size on the market, offering extremely high cost-effectiveness and performance advantages.
Samsung: DRAM sales in Q3 surged, market share first
According to the latest data, Samsung’s Q3 DRAM sales increased by 29.6% QoQ to US$13.942 billion, with market share reaching 34.8%, regaining the top spot. The main reason is the significant increase in HBM supply for Samsung’s third-quarter HBM, with HBM bit shipment growth exceeding 85% QoQ. This is mainly driven by strong demand from NVIDIA HBM3E, AI servers, and data centers for high-bandwidth memory and PC/server DRAM, pushing up prices.
MediaTek: Seizing the AI wave with new-generation AI chips
MediaTek has accumulated many years of technology and is aggressively expanding into the AI (ASIC) design service market. It has established a dedicated business unit focused on custom chips for smartphones, intelligent cockpits, and computers. According to internal data, ASIC experts predict that shipments will reach 120 million units by 2027, and the specialized chip segment is expected to grow rapidly in 2028.
